Numerical analysis of single particle impact in the context of Cold Spray: a new adhesion model

International Conference on Advances in Renewable Energy and Technologies 2016

Profizi, P.^1,3 ; Combescure, A.^1,2 ; Ogawa, K.^3

Laboratoire de Mécanique des Contacts et des Structures, INSA de Lyon, UMR-CNRS 5259, 18-20 Rue des sciences, Villeurbanne

69621, France^1

AREVA-SAFRAN Department, France^2

Fracture and Reliability Research Institute, Tohoku University, 6-6-1-11 Aramaki, Sendai, Aoba-ku, Miyagi

980-8573, Japan^3

关键词: Adhesion behaviors;    Material parameter;    Physical criterions;    Physical phenomena;    Single particle impact;    Strong localizations;    Surface adhesion;    Yield stress value;   

Others  :  https://iopscience.iop.org/article/10.1088/1755-1315/32/1/012062/pdf
DOI  :  10.1088/1755-1315/32/1/012062

来源: IOP

【 摘 要 】

A new adhesion model for numerical simulation of single particle impact in the context of Cold Spray is introduced. As in other studies, cohesive forces are put between the particle and substrate to account for adhesion. In this study however, the forces are put only when a local physical criterion is met. The physical phenomenon most often attributed to Cold Spray adhesion is a shear stress instability. The Johnson-Cook material law is used with a shear damage softening law to enable strong localization at the interface without the need for an extremely fine mesh. This localization is then detected as a drop in local yield stress value by the algorithm, which then implements a local cohesive force. The evolution of this cohesive force is defined by an energy dissipative cohesive model, using a surface adhesion energy as a material parameter. Each cohesive link is broken once all its associated surface energy is dissipated. A criterion on the damage value is also used to break a cohesive bond prematurely, to account for the effect of erosion at higher speeds. This model is found to reproduce the Cold Spray-like adhesion behavior with observed critical and maximum speeds.