Numerical Simulation of Heat Transfer Performance of Micro-heat Pipe Array based on FLUENT

2019 5th International Conference on Energy Materials and Environment Engineering

能源学;生态环境科学

Yang, Jingang^1^2 ; Yu, Tianmiao^1^2 ; Wei, Sinan^1^2 ; Wang, Xinpeng^1^2

Jingang Yang Beijing University of Technology, Beijing

100124, China^1

Jilin Jianzhu University, Changchun

130021, China^2

关键词: Basic principles;    Condensation section;    Grid technologies;    Maximum heat flux;    Micro heat pipe;    Micro heat pipe arrays;    Numerical techniques;    Simulation of heat transfer;   

Others  :  https://iopscience.iop.org/article/10.1088/1755-1315/295/3/032004/pdf
DOI  :  10.1088/1755-1315/295/3/032004

学科分类：环境科学（综合）

来源: IOP

【 摘 要 】

The structure and basic principle of heat pipe and plate micro heat pipe array are introduced in detail, and the application of FLUENT grid technology and numerical technique is introduced. The thermal conductivity, the phase change and the effect of the liquid filling rate on the heat transfer performance of the heat pipe were simulated by using FLUENT of CFD software. The results show that when the liquid filling rate is 20% ∼ 30%, the thermal conductivity of the micro heat pipe starts to rise, reaching 6.11 × 10-5 W • m-2 at the highest level. When the liquid filling rate of 30% to 40%, the thermal conductivity of the micro-heat pipe began to decline, which indicates that the best filling rate is when the liquid filling rate is 20 ∼ 30. When the temperature of the outer wall of the condensation section is 67.5 °C, the maximum heat flux can reach 8.1 × 105 W • m-2.