Simulation of Heat Dissipation in a Closed Enclosure Based On Flotherm

2018 4th International Conference on Environmental Science and Material Application

生态环境科学;材料科学

Que, Weibo^1 ; Zhang, Qiang^1 ; Zeng, Dehuai^1 ; Wang, Chenxue^2

Laboratory of Optical and Electrical Engineering Technology, Shenzhen University, Guangdong

518060, China^1

Shenzhen Key Laboratory of Advanced Manufacturing Technology for Mold AndDie, Shenzhen University, Shenzhen, Guangdong

518060, China^2

关键词: Analysis softwares;    Electronic product;    Functional characteristics;    Maximum temperature;    Reliability optimization;    Thermal simulations;    Working performance;    Working temperatures;   

Others  :  https://iopscience.iop.org/article/10.1088/1755-1315/252/3/032136/pdf
DOI  :  10.1088/1755-1315/252/3/032136

来源: IOP

【 摘 要 】

As an important method to measure the reliability of electronic products, thermal simulation is widely used in product life prediction and reliability optimization. In this paper, the relationship between the working temperature and working performance of power components and the importance of thermal simulation analysis are discussed. The basic theory of thermal analysis software Flotherm is expounded. The functional characteristics and application range of Flotherm software are introduced. The chassis power device is designed. The boundary condition setting, grid setting, and result processing of the simulation model are introduced in detail. The results illustrate that the maximum temperature of the power components can be guaranteed within the specified temperature range, which satisfies the temperature requirements for reliable operation.