Analysis of Microstructure Characteristics of Overload Trace of Copper Conductor

5th Annual International Workshop on Materials Science and Engineering

Wang, Liantie^1 ; Qi, Zibo^1

Shenyang Fire Research Institute, Wenda road 218-20 first, Huanggu District, Shenyang

110034, China^1

关键词: Macroscopic analysis;    Metallographic analysis;    Metallographic method;    Metallographic microscope;    Metallographic structure;    Microstructure characteristics;    Physical evidence;    Simulation test methods;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/585/1/012020/pdf
DOI  :  10.1088/1757-899X/585/1/012020

来源: IOP

【 摘 要 】

Metallographic method is the most commonly used technique in electrical fire physical evidence identification. Firstly, the overload test samples of electrical lines were prepared in the simulated test chamber by using the simulation test method. Then, the macroscopic analysis and metallographic analysis were carried out on the overload melting marks of copper wires prepared in the early stage with the use of advanced instruments such as metallographic microscope and video microscope. The transition zone between the melt site and the substrate is not obvious, and there are many protruding weld marks of different sizes along the surface of the copper wire, and the wire diameter of the wire has obvious thickness change. The characteristic of metallographic structure is that the outer layer is eutectic, the inner layer is dendrite or dendrite coexists with eutectic, the size of the equiaxed crystal of the adjacent wire melting mark is obviously different, and some of them have more holes along the axis.