会议论文详细信息
2019 International Conference on Intelligent Manufacturing and Intelligent Materials
Research on Heat Sissipation System Based on High Power LED-UV Curing Equipment
Haichao, Li^1 ; Jinyao, Li^1 ; Jingxiang, Xu^1 ; Mingming, Zhang^1 ; Jifei, Cai^1 ; Guishan, Zhang^1
School of Mechanical and Electrical Engineering, Beijing Institute of Graphic Communication, Daxing District, Beijing, China^1
关键词: Curing devices;    Curing methods;    Curing system;    Curing technology;    High power LED;    P-n junction;    Ready to use;    Simulated analysis;   
Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/565/1/012016/pdf
DOI  :  10.1088/1757-899X/565/1/012016
来源: IOP
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【 摘 要 】

LED-UV printing curing system is a new green printing curing technology for curing UV ink. Compared with the traditional UV curing device UV-LED curing device, the light source can be stabilized and ready to use without preheating, and the energy consumption is lower. It does not produce ozone and voc, and it is a green curing method. However, since a part of the energy of the LED chip is lost in the form of heat, the temperature of the PN junction is increased to lower the service life and light decay. The heat sink model was established by Solid Works and simulated analysis was performed using Fluent. A heat dissipation system for high-power LED-UV curing device was designed based on the simulation results.

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