Bonding Heating Control Based on PID

2019 International Conference on Advanced Electronic Materials, Computers and Materials Engineering

无线电电子学;计算机科学;材料科学

Yu, Ye^1

Shanghai Second Polytechnic University, Shanghai, China^1

关键词: Bonding process;    Chip production;    Chip-manufacturing;    Heating control;    Heating effect;    Material deformation;    Temperature oscillations;    Vacuum environment;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/563/4/042074/pdf
DOI  :  10.1088/1757-899X/563/4/042074

来源: IOP

【 摘 要 】

In the process of chip production, the bonding machine, as the post-process of chip manufacturing, is a key process to determine the chip productivity and quality. The process of wafer bonding usually involves heating silicon wafer, glass backing and other materials to a certain temperature in a vacuum environment, applying a certain pressure, and bonding for a certain period of time. In the bonding process, the time to heat the material to the specified temperature accounts for about 20% of the whole bonding process. Therefore, shortening the heating time has a great effect on improving the yield. In addition, in the process of heating and pressure, improving the heating stability, reducing the temperature oscillation, can reduce the material deformation and improve the bonding accuracy. In this paper, the intelligent temperature control system based on PID is adopted to control and adjust the bonding heating in real time, so as to shorten the heating time, reduce heating control oscillation, improve the heating effect, and improve the yield and yield.