2019 International Conference on Advanced Electronic Materials, Computers and Materials Engineering | |
The Research of Reliability of CX-1B-5 Connectors Coupling in AIT process of spacecraft | |
无线电电子学;计算机科学;材料科学 | |
Zhang, Wei^1 ; Wang, Dongmei^1 ; Zhao, Peirong^1 ; Xie, Xilong^1 ; Zuo, Na^1 | |
Beijing Institute of Spacecraft Environment Engineering, Beijing Engineering Research Center, Intelligent Assembly Technology and Equipment for Aerospace Product, Beijing, China^1 | |
关键词: Bending fatigue resistances; Connection failures; Fatigue fracture; Fracture morphology; Integration process; Tensile forces; Wire breakages; Wire insulation; | |
Others : https://iopscience.iop.org/article/10.1088/1757-899X/563/3/032027/pdf DOI : 10.1088/1757-899X/563/3/032027 |
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来源: IOP | |
【 摘 要 】
This paper reviews the applications of CX-1B-5 connectors in assembly and integration process of spacecraft. Wire breakage near the solder joint is the common phenomenon of the connection failure, through fracture morphology and fault tree analysis, tensile force after repeated bending which is a key factor leads to the fatigue fracture. Because the bending of the wire at the root of the solder joint is unavoidable, wire insulation thickening method and anti-wicking tools are used to improve the reliability of CX-1B-5 connectors coupling, with the test showing the bending fatigue resistance improved by 110% by using anti-wicking tools.
【 预 览 】
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The Research of Reliability of CX-1B-5 Connectors Coupling in AIT process of spacecraft | 1250KB | download |