Solderability of Sn-0.7Cu-0.05Ni-xZn Solder Ball on Sn-0.7Cu and Sn-0.7Cu-0.05Ni Solder Coating

Joint Conference on Green Engineering Technology & Applied Computing 2019

工业技术（总论）;计算机科学

Ramli, M.I.I.^1 ; Mohd Salleh, M.A.A.^1

Center of Excellence Geopolymer and Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, Jejawi, Perlis

02600, Malaysia^1

关键词: Maximum forces;    Sn-0.7cu;    Solder balls;    Solderability;    Test machine;    Wetting balance;    Wetting force;    Wetting time;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/551/1/012094/pdf
DOI  :  10.1088/1757-899X/551/1/012094

来源: IOP

【 摘 要 】

In this study, the solderability of the Sn-0.7Cu-0.05NixZn solder ball on solder coating were investigated by using Gen3 wetting balance test machine. By using wetting balance test in globule mode, the solderability of solder ball was determined by the maximum force and wetting time. The result of a good solderability is generally referred to short wetting time and high wetting force. It was found that by increasing amount of Zn in Sn-0.7Cu-0.05Ni solder ball, the maximum force was decrease and wetting time was increase. This result indicates that by increasing amount of Zn in Sn-0.7Cu-0.05Ni solder ball, it will decrease the solderability of solder ball to the solder coating.