会议论文详细信息
2018 6th International Conference on Mechanical Engineering, Materials Science and Civil Engineering
Simulation Analysis of Ground Infrared Background Based on Numerical Fitting Model
材料科学;机械制造;土木建筑工程
Chengcheng, Wang^1 ; Tao, Sun^1 ; Yan, Wang^2
Naval Aeronautical University, Yantai, Shandong, China^1
National University of Defense Technology, Changsha, Hunan, China^2
关键词: Ground temperature field;    Infrared background;    Multispectral images;    Numerical fitting;    Scene generation;    Scene simulations;    Simulation analysis;    Surface temperatures;   
Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/542/1/012014/pdf
DOI  :  10.1088/1757-899X/542/1/012014
来源: IOP
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【 摘 要 】

In view of the poor real-time and authenticity of the ground scene generation in the infrared scene simulation, a method of ground infrared background generation based on numerical fitting model is proposed. Combining with the main influencing factors of ground infrared scene, a numerical fitting model of surface temperature field of typical ground material is established. On the basis of the texture of the ground material area, the infrared texture of the ground is dynamically generated in the shader by combining the numerical fitting model of the temperature field and the texture mask generated by the multi-spectral image method. The simulation results show that the numerical fitting model of ground temperature field is in good agreement with the measured data, and the generated infrared texture is more realistic, which meets the real-time and authenticity requirements of infrared scene simulation system.

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