Three-dimensional stacking IC packaging technology for NAND-flash memory

International Workshop "Advanced Technologies in Material Science, Mechanical and Automation Engineering – MIP: Engineering – 2019"

材料科学;机械制造;原子能学

Perminov, V.V.^1 ; Putrolaynen, V.V.^1 ; Shtykov, A.S.^1 ; Yartsev, A.V.^1^2

Petrozavodsk State University, 31 Lenina str., Petrozavodsk

185910, Russia^1

GS Nanotech, 11 Industrialnaya str., Gusev

238050, Russia^2

关键词: IC packaging;    Memory modules;    Multi chip packaging;    NAND flash memory;    Nand memory;    Solid state drives;    Technological operations;    Three dimensional stacking;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/537/3/032064/pdf
DOI  :  10.1088/1757-899X/537/3/032064

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

The article presents the technology of three-dimensional multi-chip packaging and testing of NAND memory module implemented at GS Nanotech in collaboration with Petrozavodsk State University. The main technological operations and quality management methods at each stage of memory modules manufacture are described. These memory modules can be used for solid-state drives production.