Influence of Press Temperature on The Properties of Binderless Particleboard

International Conference on Science and Innovated Engineering

工业技术（总论）;自然科学（总论）

Milawarni^1 ; Nurlaili^2 ; Sariadi^3 ; Amra, Siti^1 ; Yassir^1

Electrical Engineering Departement, Politeknik Negeri Lhokseumawe, Indonesia^1

Mechanical Engineering Departement, Politeknik Negeri Lhokseumawe, Indonesia^2

Chemical Engineering Departement, Politeknik Negeri Lhokseumawe, Indonesia^3

关键词: Binderless particleboards;    Bond characteristics;    Internal bond strengths;    Mechanical and physical properties;    Modulus of rupture;    Physical and mechanical properties;    Pressing temperature;    Thickness swelling;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/536/1/012066/pdf
DOI  :  10.1088/1757-899X/536/1/012066

来源: IOP

【 摘 要 】

All experimental binderless particleboard were manufactured using coffee husk. In this case, we apply a method so called an oxidation method that uses 15% hydrogen peroxide (H2O2) and a Ferro-sulphate (FeSO4) 7.5% catalyst. The methods refer to JIS A 5908-2003 standard. In this paper, through the test, we evaluate some properties of the panel including density, modulus of rupture (MOR), modulus of elasticity (MOE), internal bond strength (IB), thickness swelling (TS) and water absorption (WA). The panel is made with a target density of 0.75 g / cm3 using pressing temperatures of 150,160,170,180 and 1900C. The result shows that, by increasing pressing temperatures, some parameters such as the modulus of rupture, modulus of elasticity and internal bonding of the particleboards tend to increase while their water absorption and thickness swelling decreased. The best physical and mechanical properties of binderless particleboard from coffee husk were obtained in pressing temperature of 1800C. Microscopic study using Scanning Electron Microscopy (SEM) revealed that panels made with pressing temperature of 1800C have bond characteristics that support the improvement of panel properties. Thus, this study addressed that the mechanical and physical properties of the panel were influenced by pressing temperature.