Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions

2nd International Workshop on Materials Science and Mechanical Engineering

机械制造;材料科学

Mu, G.Q.^1 ; Qu, W.Q.^1 ; Wu, Y.C.^1 ; Zhuang, H.S.^1

School of Mechanical Engineering and Automation, Beihang University, No.37, Xueyuan Road, Haidian District, Beijing

100191, China^1

关键词: Aging conditions;    Aging temperatures;    Fracture feature;    Interfacial compounds;    Interfacial microstructure evolution;    Sn-based solders;    Solder interfaces;    Thermal aging tests;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/504/1/012008/pdf
DOI  :  10.1088/1757-899X/504/1/012008

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Sn-based solder is used for soldering a gold alloy and a brass sheet. Subsequently thermal aging tests are performed. The influence of thermal aging on the interfacial microstructure evolution of gold alloy/Sn-based solder and its mechanical properties was analysed. The results show that the aging time and aging temperature have large influence on the growth of interfacial compounds, and the interfacial compounds show a multiply-sublayers structure, the main components are AuNi2Sn4, AuSn4, Ni3Sn4 and Ni3Sn. The hardness of the interfacial compounds show a distinct layered phenomenon, in which the hardness of the first layer is the highest. Shear tests indicated that the failure happened at the gold alloy/Sn-based solder interface close to the gold alloy, showing obvious brittle fracture features. Shear strength decreases with increasing aging time at the aging temperature of 150C and 175C.