Heat transfer at dielectric - metallic interfaces in the ultra-low temperature range

27th International Cryogenics Engineering Conference and International Cryogenic Materials Conference 2018

Liberadzka, J.^1^2 ; Golm, J.^1 ; Koettig, T.^1 ; Bremer, J.^1 ; Ter Brake, H.J.M.^2

CERN, Geneva

CH-1211, Switzerland^1

University of Twente, Enschede, Netherlands^2

关键词: Dynamic heat transfers;    Kapitza resistance;    Metallic interfaces;    Steady state;    Thin layers;    Ultra low temperatures;    Ultra-cold;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/502/1/012133/pdf
DOI  :  10.1088/1757-899X/502/1/012133

来源: IOP

【 摘 要 】

In the framework of the AEgIS project a series of steady state and dynamic heat transfer measurements at ultra-low temperatures was conducted in the Central Cryogenic Laboratory at CERN. Two sandwich setups, simulating the behaviour of ultra-cold AEgIS electrodes, were investigated and compared, namely: A sapphire-indium-copper and a sapphire-Titanium-gold-indium-copper sandwich. The total thermal resistivity of both sandwich setups was evaluated as a function of the influence of normal and superconducting thin layers and multiple dielectric-metallic interfaces in terms of Kapitza resistance. The resulting limitations of the electrode's design are presented.